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Technology & Science Last Updated: Mar 15th, 2008 - 19:35:59


OLOVO Announces Agreement for Supplying Advanced Packaging Wafer Bumping Plating Anodes
By Peter Emanuel
Mar 15, 2008, 19:34

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Menlo Park, CA - OLOVO, LLC, a leading low-alpha and interconnect materials supplier, has reached an agreement with Semitool, Inc. whereby OLOVO has become licensed to supply anodes for use in Semitool’s electrochemical deposition systems. OLOVO’s qualification as an authorized vendor allows OLOVO to expand the reach of its low-alpha products to Semitool’s customer base and to provide them with an additional source of specialty low-alpha and interconnect materials.

According to Peter Emanuel, VP of Sales at OLOVO, "We are extremely happy with this arrangement with Semitool, and we look forward to supplying Semitool's customer base with high quality plating anodes, which are a key component in the wafer bumping process. We believe this offers tremendous mutual benefit to our respective companies and clients."

About OLOVO, LLC

OLOVO, LLC is a supplier of low-alpha products which help reduce 'soft errors' in sensitive flip-chip applications. Soft errors are mistakes in logical calculations caused by collisions between alpha particles and logic components in embedded memory and high-speed integrated circuits. Traditional solder materials used in flip-chip interconnect are naturally high in alpha particle emission, causing unacceptable soft error rates in circuit devices. OLOVO is a privately held company with headquarters in Menlo Park, California, USA. OLOVO has been a leading supplier of low-alpha lead materials since its entry into the market in 1998. OLOVO's firm commitments to safety, quality assurance, and the environment have made OLOVO a valuable contributor to the semiconductor industry and general community. For more information, please visit www.olovo.com.

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Olovo

Peter Emanuel

(650) 353-6399

www.olovo.com




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